WDS-1250 BGA Soldering Station For Large Size PCB Motherboard Repair

Most advanced wds-1250 full-auto bga rework station for large size pcb motherboard repair

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Product Introduction:

WDS-A1250 its designed for big size industrial control motherboard&5Gservice motherboardrepairing(PCB repair maximum size:1200mmX700mm),all operation is control by computer.Equipped HD optical

alignment system,hot air+IR+gas which heating way is 3 in 1(include nitrogen or compressed air).All in one BGA rework station which all movement actions are made of electric motor drive and software control.Suit for removing or soldering any kind of seal chips and BGA chips,any special or difficult chipsPOP, CCGA,

BGA,QFN,CSP,LGA,Micro SMD,MLF(Micro Lead Frames) .

Technical Parameters of WDS-1250 full-auto bga rework station

Specifications of WDS-1250 full-auto bga rework station

• Independent ten axis interlock,ten electric motor drive control all movement.Up&down
  temperature zone/PCB movement and optical alignment system X/Y movement all can
  control by computer,easy operation.Machine can store more than 100temperature
  profile,suit for large quantities motherboard rework,increase the work efficiency,high-level
  automatic
• Heat and mount head design 2 in 1,which can auto rotate,mount,soldering and auto
  remove function;
• Up hot air head use two channel heating system,air outlet diameter is 80mm,when rework big size motherboard,temperature heating very fast,temperature uniformity and cooling fast(temperature can down at one time50-80degree),which can meet the requirement of the lead free chip rework process.Down temperature use infrared&hot air heating.IR directly heating on the heating area,together heating with the hot air,this can make PCB heating up very fast(speed can reach 10°C/S),the temperature can keep uniformity at same time;
• Independent three temperature zone(upper&lower&infrared preheater zone),upper
  and lower temperature zone can auto move,can automatically reach any place on the infrared preheater zone.Down temperature can be up and down movement,support PCB,using motor auto control. PCB in the fixture not move, up and down heating head can move to any chip place on the PCB.

• Large bottom preheater zone,adopt good quality dark infrared heating panel which import from Germany,temperature heating up fast,preheating uniformity,preheating area of 650*520 mm.When reworking large size PCB,the system with preheating advanced function.When open the machine,the infrared area will preheating the PCB firstly.Once PCB reach the setting trigger temperature,up and lower hot air start to heating.Preheat the PCB firstly,this is better to reduce the heat loss when PCB absorption of heating,solder ball can reach the melting temperature faster,avoid to change PCB shape efficiency,increase repair success rate.
• X, Y direction of movement and the overall unique design, making the equipment space
  is fully utilized to a relatively small size of equipment to achieve large area PCB rework, the maximum clamping plate size up to 1200*700mm, no rework dead ends;
• Built-in vacuum pump, Φ-axis arbitrary rotation, high-precision stepper motor control,
  automatic memory function, precision fine-tune nozzle;
• Suction nozzle automatically identify suction and placement height, the pressure can be
  controlled in the small range of 10 grams, with 0 pressure suction, placement function, for smaller chips;the suction rod with flow function,on heating process,it will cooling BGA surface,will reduce the temperature difference between BGA surface and solder ball position,can protect the chip avoid to damage by high temperature.

• Color high-definition optical system,with color-difference resolution, auto focus,software operating functions, 22x optical zoom, rework Maximum BGA size 120 *120mm;IPC+PLC control,embedded IPC,touch screen operation interface. PLC control,display temperature curve immediately,show setting curve and measured curve,can analyze the measured temperature curve.10sections up(down) temperature+10sections constant temperature,can store more than 100group temperature curve,can analysis the temperature curve on the touch screen;different sizes Titanium alloy nozzles,easy change,can 360°rotate.
• 13 pcs temperature sensor, can monitor and analysis more place on the PCB.
• Equipped with nitrogen inlet, use nitrogen to protect the soldering,more the rework more safety and reliable.
• Suction rod with manual flow cool down system,on BGA reworking process,it can cool down chip surface at any time.It will decrease temperature difference,efficiently protect chip avoid to damage by high temperature;
• With solid-state operation display, make temperature more safe and reliable;
• Match side camera which can observe the side ball melting , easy to determine the curve.(this function is optional)
• High sensitive touch screen IPC control,intelligent operation system. It is can remote-control after networking.